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Achilles - Solution de transport pour wafers

Achilles offre une gamme complète de modèles de canisters compatibles à chaque étape de transformation des wafers, tous utilisant des matériaux antistatiques et de haute pureté, et compatibles avec les machines d'emballage.

- Série Protos Carrier Z: le meilleur modèle, offrant la meilleure protection avec le volume le plus compact. Évitez les mouvements latéraux grâce à un design spécial. 25 wafers de capacité. Peut être utilisé avec des entretoises (interleafs) ou des anneaux rigides. Pour les wafers de 8 "et 12".

- Série Protos Carrier MA: Améliorez l'efficacité de l'expédition, 25 wafers de capacité. Peut être utilisé avec des entretoises (interleafs) ou des anneaux rigides. Pour wafers de 4 ", 5", 6 ", 8" et 12".

- Série Protos Carrier ND: support pour wafers coupés en puces, peut contenir entre 13 et 25 wafers selon le modèle. Compatible avec des wafers montés sur cadres de 6 ", 8" et 12".

  • Semiconducteurs, solaire et électronique
  • Protos Carrier MA series: Improve the shipping efficiency, 25 wafers of capacity. Can be used with spacers or rings. For 4“, 5“, 6“, 8“ and 12“ wafers.  
Part Number MA-5 (5inch carrier)
MA-6 (6inch carrier) MA-6 (6inch carrier)
MA-6S(6inch slim carrier) MA-6S(6inch slim carrier)
MA-8 (8inch carrier) MA-8 (8inch carrier)
MA-8S(8inch slim carrier) MA-8S(8inch slim carrier)
MA-12 (12inch carrier) MA-12 (12inch carrier)
Feature Double-wall construction provides excellent impact resistance while wafers are firmly protected inside.
Can be used by automatic wafer loading equipment (robots). Can be used by automatic wafer loading equipment (robots).
A 3.5 inch floppy disk for data can be stored under the lid. (8 inches only) A 3.5 inch floppy disk for data can be stored under the lid. (8 inches only)
The lid and body are supplied as a set, which opens and closes by turning the lid. The lid and body are supplied as a set, which opens and closes by turning the lid.
Partial filling acceptable. Partial filling acceptable.
Surface Resistance <1.0×106Ω
Material Conductive Polypropylene
  • Protos Carrier Z series: the finest model, offering the best protection with the lowest volume. Avoid lateral moves thanks to a special design. 25 wafers of capacity. Can be used with spacers or rings. For 8“ and 12“ wafers.
Part Number Z200 (correspond to dicing frame for 8 inch wafer)
Z300 (correspond to dicing frame for 12 inch wafer) Z300 (correspond to dicing frame for 12 inch wafer)
Features Compact design can reduce transportation costs.
One-push(snap-lock)allows easy packing of wafers One-push(snap-lock)allows easy packing of wafers
Control the vibration of wafer by movable wall. Control the vibration of wafer by movable wall.
Adoption of clean plastics reduces conatamination on wafer surfaces. Adoption of clean plastics reduces conatamination on wafer surfaces.
Use in combination with ring spacers makes noncontact transportation of wafers possible. Use in combination with ring spacers makes noncontact transportation of wafers possible.
Z300 is provided with Kinematic Coupling that allows wafers to be readily alligned with transfer equipment. Z300 is provided with Kinematic Coupling that allows wafers to be readily alligned with transfer equipment.
Surface resistance < 1.0×105Ω
Material Conductive PP
  • Protos Carrier ND series: carrier for diced wafers, can contain between 13 and 25 wafers depending on the model. Compatible with 6“, 8“ and 12“ framed wafers.
Part Number ND-6 (correspond to dicing frame for 6 inch wafer)
ND-8 (correspond to dicing frame for 8 inch wafer) ND-8 (correspond to dicing frame for 8 inch wafer)
Feature Simplify the packing of diced wafer on frame to increase work efficiency.
Diced wafer on frame can be stacked up to 13 pieces. Diced wafer on frame can be stacked up to 13 pieces.
With stopper for dicing frame With stopper for dicing frame
(It varies by the kind of frame) (It varies by the kind of frame)
Cushioning material and spacer correspond to diced wafer on frame (6 inch and 8 inch) are available. Cushioning material and spacer correspond to diced wafer on frame (6 inch and 8 inch) are available.
Please ask for more information. Please ask for more information.
Surface Resistivity < 1.0×106Ω
Material Conductive Polypropylene
AchillesAchille fabrique des systèmes de manutention pour wafer conçus avec des matériaux de haute pureté pour un transport sécurisé des wafers.
[Achilles, Wafer package system, Wafer carriers, Protos Carrier, Canisters, Transport pour plaquette]