Achilles offre une gamme complète de modèles de canisters compatibles à chaque étape de transformation des wafers, tous utilisant des matériaux antistatiques et de haute pureté, et compatibles avec les machines d'emballage.
- Série Protos Carrier MA: Améliorez l'efficacité de l'expédition, 25 wafers de capacité. Peut être utilisé avec des entretoises (interleafs) ou des anneaux rigides. Pour wafers de 4 ", 5", 6 ", 8" et 12".
- Série Protos Carrier ND: support pour wafers coupés en puces, peut contenir entre 13 et 25 wafers selon le modèle. Compatible avec des wafers montés sur cadres de 6 ", 8" et 12".
Part Number | MA-5 (5inch carrier) |
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MA-6 (6inch carrier) | MA-6 (6inch carrier) |
MA-6S(6inch slim carrier) | MA-6S(6inch slim carrier) |
MA-8 (8inch carrier) | MA-8 (8inch carrier) |
MA-8S(8inch slim carrier) | MA-8S(8inch slim carrier) |
MA-12 (12inch carrier) | MA-12 (12inch carrier) |
Feature | Double-wall construction provides excellent impact resistance while wafers are firmly protected inside. |
Can be used by automatic wafer loading equipment (robots). | Can be used by automatic wafer loading equipment (robots). |
A 3.5 inch floppy disk for data can be stored under the lid. (8 inches only) | A 3.5 inch floppy disk for data can be stored under the lid. (8 inches only) |
The lid and body are supplied as a set, which opens and closes by turning the lid. | The lid and body are supplied as a set, which opens and closes by turning the lid. |
Partial filling acceptable. | Partial filling acceptable. |
Surface Resistance | <1.0×106Ω |
Material | Conductive Polypropylene |
Part Number | ND-6 (correspond to dicing frame for 6 inch wafer) |
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ND-8 (correspond to dicing frame for 8 inch wafer) | ND-8 (correspond to dicing frame for 8 inch wafer) |
Feature | Simplify the packing of diced wafer on frame to increase work efficiency. |
Diced wafer on frame can be stacked up to 13 pieces. | Diced wafer on frame can be stacked up to 13 pieces. |
With stopper for dicing frame | With stopper for dicing frame |
(It varies by the kind of frame) | (It varies by the kind of frame) |
Cushioning material and spacer correspond to diced wafer on frame (6 inch and 8 inch) are available. | Cushioning material and spacer correspond to diced wafer on frame (6 inch and 8 inch) are available. |
Please ask for more information. | Please ask for more information. |
Surface Resistivity | < 1.0×106Ω |
Material | Conductive Polypropylene |