ADT – Dicing Peripheral
ADT dicing peripheral is a precision cutting tool used in semiconductor and electronics manufacturing for precise and efficient dicing of wafers and substrates into smaller chips. It features high accuracy, low kerf loss, and ex...
ADT dicing peripheral is a precision cutting tool used in semiconductor and electronics manufacturing for precise and efficient dicing of wafers and substrates into smaller chips. It features high accuracy, low kerf loss, and excellent edge quality for optimal yield and reliability.
Key Features
- Used for dicing wafers and substrates into smaller chips
- High accuracy and low kerf loss for optimal yield
- Compatible with a wide range of materials and thicknesses
- Robust and durable design for long-term use
- Offers advanced automated blade height adjustment and real-time monitoring.