EXPEGO is a laser processing workstation designed for high-precision applications in the electronic, precision engineering, and photovoltaic industries. It is mainly used for microvia drilling, cutting (routing), structuring and cavity formation in PCBs with typical dimensions as 610 x 460 mm and 635 x 540 mm.
Applications | Micro Via Drilling, Routing, Depaneling, Micro Structuring, Selective Ablation, Cavity Formation |
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Accuracy | < +/-10 μm abs. < +/-2 μm repeatability |
Substrates | Dimension up to 29.5” x 25” (750 mm x 635 mm) Rigid-, flex-PCBs, ceramic, glass and advanced materials |
Available laser sources | Wavelength: 9.4, 10.6 μm (CO2), 1064, 1030, 532, 515, 355 nm Pulse: μs, ns, ps, fs |
Dimensions | 1750 x 2200 x 2600 mm |