ULTAGO is a powerful laser processing workstation designed for high-precision applications in the photovoltaic, precision engineering, and electronic industries. It achieves maximum throughput for solar cells or ceramic substrates and is used in high-volume production environments. Different from linear table machines, in the turntable machine loading, unloading, alignment, as well as laser processing are carried out in parallel in order to reach optimum productivity.
Applications | Laser Contact Opening for PERC, Laser Doped Selective Emitter, Front side LCO, Laser Direct Cleaving, various applications in electronics processing |
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Accuracy | < +/-35 μm (1 sigma) < +/-10 μm optionally < +/-2 μm repeatability |
Substrate | Dimension up to 161 x 161 mm Thickness > 100 μm mono or poly crystalline silicon square/ pseudo square, ceramic, PCB |
Available laser sources | Wavelength: 1064, 1030, 532, 515, 355 nm Pulse: μs, ns, ps, fs |
Throughput | 4000 wafer per hour |