Achilles offers a full range of wafer carriers models depending on the wafer types, all using antistatic and high-purity material, and compatible with packing machines:
- Protos Carrier MA series Improve the shipping efficiency, 25 wafers of capacity. Can be used with spacers or rings. For 4“, 5“, 6“, 8“ and 12“ wafers.
- Protos Carrier ND series Carrier for diced wafers, can contain between 13 and 25 wafers depending on the model. Compatible with 6“, 8“ and 12“ framed wafers.
Part Number | MA-5 (5inch carrier) |
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MA-6 (6inch carrier) | MA-6 (6inch carrier) |
MA-6S(6inch slim carrier) | MA-6S(6inch slim carrier) |
MA-8 (8inch carrier) | MA-8 (8inch carrier) |
MA-8S(8inch slim carrier) | MA-8S(8inch slim carrier) |
MA-12 (12inch carrier) | MA-12 (12inch carrier) |
Feature | Double-wall construction provides excellent impact resistance while wafers are firmly protected inside. |
Can be used by automatic wafer loading equipment (robots). | Can be used by automatic wafer loading equipment (robots). |
A 3.5 inch floppy disk for data can be stored under the lid. (8 inches only) | A 3.5 inch floppy disk for data can be stored under the lid. (8 inches only) |
The lid and body are supplied as a set, which opens and closes by turning the lid. | The lid and body are supplied as a set, which opens and closes by turning the lid. |
Partial filling acceptable. | Partial filling acceptable. |
Surface Resistance | <1.0×106Ω |
Material | Conductive Polypropylene |
Part Number | ND-6 (correspond to dicing frame for 6 inch wafer) |
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ND-8 (correspond to dicing frame for 8 inch wafer) | ND-8 (correspond to dicing frame for 8 inch wafer) |
Feature | Simplify the packing of diced wafer on frame to increase work efficiency. |
Diced wafer on frame can be stacked up to 13 pieces. | Diced wafer on frame can be stacked up to 13 pieces. |
With stopper for dicing frame | With stopper for dicing frame |
(It varies by the kind of frame) | (It varies by the kind of frame) |
Cushioning material and spacer correspond to diced wafer on frame (6 inch and 8 inch) are available. | Cushioning material and spacer correspond to diced wafer on frame (6 inch and 8 inch) are available. |
Please ask for more information. | Please ask for more information. |
Surface Resistivity | < 1.0×106Ω |
Material | Conductive Polypropylene |