Norcom 2020-WL

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SINGAPORE

Kelvin Low, Senior Manager

Phone +65 6274 1222

Fax +65 6273 1503

Contact Email

DKSH Singapore Pte Ltd
625 Lorong 4 Toa Payoh, #03-00
319519 Singapore
Singapore

THAILAND

Lau Chek Chung, General Manager, Semiconductor & Electronics, Malaysia, Thailand and Vietnam

Phone +66 2 639 7000

Contact Email

DKSH (Thailand) Limited
2106 Fantree 4 Building, Sukhumvit Road,
Phrakhanong-Tai, Phrakhanong 10260 Bangkok
Thailand

VIETNAM

Nguyen Phan Loan Anh, Assistant Sales Manager

Phone +84 8 38125806

Contact Email

DKSH Technology Co.,Ltd
5th Floor, Viettel Complex, 285 Cach Mang Thang Tam Ward 12, District 10
70000 Ho Chi Minh City
Vietnam

VIETNAM

Ly Thi Bich Duyen (Bella), Senior Supervisor

Phone +84 8 38125806

Contact Email

DKSH Technology Co.,Ltd
5th Floor, Viettel Complex, 285 Cach Mang Thang Tam Ward 12, District 10
70000 Ho Chi Minh City
Vietnam

Norcom 2020-WL_Front View

Norcom 2020-WL_Detail View

Norcom 2020-WL_Close Up View

The NorCom 2020-WL inspects MEMS and other wafer level devices for both gross and fine leaks simultaneously while automatically rejecting all leaking devices. The system accepts up to an eight inch wafer that can be optionally loaded into the machine on saw frames measuring up to eleven inches square. The equipment is easy to setup and use, and the results can be networked to an SPC system for tracking all devices tested. It is ideal for leak testing any wafer level device that has an internal cavity. The system can inspect up to 1000 devices per cycle in both the singulated and un-singulated states.

Key Features

Simultaneously tests for fine and gross leaks
Can inspect up to an 8″ wafer on or off the saw frame
Inspects MEMS and other wafer level devices
Provides Statistical Process Control (SPC) for tracking of test results

Key Industries

Semiconductor, Solar & Electronics
Aerospace
Automotive
Defense
Electronics
Medical

NorCom Systems, Inc. manufactures the NorCom 2020 advanced optical leak test system for hermetically sealed packages. The NorCom 2020 provides automated, in-line, full matrix gross and fine leak testing performed simultaneously with direct measurement of package leak rates in cc-atm/sec. Package types include MEMS, PC board-mounted devices, Hybrids, crystal oscillators, and Hi-Rel.