TSM - Vacuum Reflow

Back to product overview

Contact us
Downloads

INDONESIA

Maggie Yang, Managing Director, Technology

Phone +62 21 2988 8557

Fax +62 22 2988 7870

Contact Email

PT. DKSH Indonesia
AIA Central 39th floor. Jalan Jenderal Sudirman Kavling 48A
12930 Jakarta Selatan
Indonesia

MALAYSIA

Tay Tun Yong, Technical Sales & Services Manager

Phone +60 4 645 2672

Contact Email

DKSH Technology Sdn. Bhd.
No. 108-B-01-08, Setia Spice Canopy, Jalan Tun Dr. Awang,
11900 Bayan Lepas, Penang
Malaysia

SINGAPORE

Kelvin Low, Senior Manager

Phone +65 6471 1466

Contact Email

DKSH Singapore Pte Ltd
625 Lorong 4 Toa Payoh, #03-00
319519 Singapore
Singapore

TSM Vacuum Reflow Download Brochure - Protected
(PDF, 4 MB)

Single Vacuum Reflow_Front View

Single Vacuum Reflow_Back View

Twin Vacuum Reflow_Front View

The TRV series offers the outstanding productivity and safety operation of equipment. Particularly , the Compact Vacuum Chamber and Conveyor are technically proved solutions in the field through a technical partnership with ETC.

Key Features

Completely sealable TSM’s vacuum Reflow, dedicated compression chamber
Transfer System without jamming PCB (technical partnership with ETC)
Prevent PCB Drop by minimizing the gab between in/outlet entrance of conveyor in vacuum chamber
Strengthen durability without conveyor driven roller in high temperature section
Able to correspond with minimized vacuum chamber with embedded vacuum pump
Reduce time of vacuuming and easily control vacuum

Available models

Single Vacuum Reflow

Features

Dramatically reduction of Solder Void
IPCB transferring system
Eco-friendly ultra low power consumption and high thermal insulation specification
Standard option for high efficiency and collection system of large quantity Flux
Heating method of up/down hot air circulation

Double Vacuum Reflow

Key Features

Independent Twin Vacuum Reflow as the World Premier (2X Vacuum Chamber + 2X Oven + 2X PC independent operation)
Doubled productivity compared to Single Reflow
Completely vacuumable dedicated compression chamber of TSM’s vacuum Reflow
Transport System without jamming PCB (ETC Technical Partnership)
Minimize the gab of in/out conveyor to prevent PCB Drop
Enhanced durability with none conveyor driven roller in high temperature sections

Key Industries

Semiconductor, Solar & Electronics

TSM has been produced for Reflow Oven and Nitrogen generator with a representative model, Full Auto Soldering Machine since the company’s foundation in 1990.