ADT - Dicing Saw

ADT 8030 Dicing system has two facing spindles that can simultaneously dice wafers at high throughput. ADT 8030 is a high accuracy system that can dice product up to 12” in diameter or 12” × 12” product, at high performances and low cost of operation.

Features

• Flexibility - Supports Hub and Hubless blades up to 3” O.D.
• Spindles of 1.8 kW or 2.2 kW high power
• Bridge type frame supporting efficient wafer processing

ADT 8020 Dicing system has two facing spindles that can simultaneously dice wafers at high throughput. ADT 8020 is a high accuracy system that can dice product up to 8” in diameter, at high performances and low cost of operation.

Features

• Flexibility - Supports Hub and Hubless blades up to 3” O.D.
• Spindles of 1.8 kW or 2.2 kW high power
• Intuitive operation interface using a large 19” touch screen monitor

ADT 7900 series has two facing spindles that can simultaneously dice wafers or packages at high throughput. ADT 7900 series is a high accuracy system that can dice product at high performances and low cost of operation.

Features

• Simple Blade Change
• SECS/GEM platform ready
• Full access to any area of the system for easy maintenance

The 7120 / 7130 families of 2” and 4” spindle dicing systems deliver a high level of affordability and flexibility to support your needs.

Features

• Support 2"-3" and 4"-5" blade O.D. with large ‘Z’ stroke
• ‘X’ axis air bearing for smooth motion and super cut quality
• Automation with high resolution optics

The 7200 system offers a wide range of advanced automation and process monitoring option to meet the throughput and quality requirements of your most challenging dicing applications: silicon, glass on silicon, glass, BGA & QFN packages, LTCC, ceramic, PCB and other hard material applications.

Features

• Efficient wafer handling system
• Continuous digital magnifications vision system
• Blade wear prediction algorithm reduces height measurement time and increases UPH