Scia Systems - PEVCD/RIE Systems - scia Cube 300/750

	scia Cube 300	scia Cube 750
Substrate size	Up to 300 mm x 200 mm	Up to 750 mm x 750 mm
Substrate holder	Water cooled, RF bias	Water cooled, RF bias
Substrate temperature	Alternatively cryo cooling down to -10°C or heating up to max. 700°C	Alternatively cryo cooling down to -10°C or heating up to max. 850°C
Plasma source	Linear microwave ECR-source PL400 and/or RF parallel plate	Linear microwave ECR-source PL1300 and/or RF parallel plate arrangement
Power supply	MW-Power: max. 9000 W RF-Power:max. 600 W	MW-Power: max. 48 kW, RF-Power: max. 3 kW
Base Pressure	< 1 x 10-6 mbar	< 1 x 10-6 mbar
System dimensions (W x D x H)	1.90 m x 1.30 m x 2.20 m (without electrical rack and pumps)	3.70 m x 3.40 m x 2.20 m (without electrical rack, pumps and loading system)
Tool configurations	1 process chamber, 1 load-lock	1 process chamber, 1 loading system, 1 load-lock
Software interface	SECS II / GEM	SECS II / GEM

scia Cube 300

scia Cube 750

Substrate size

Up to 300 mm x 200 mm

Up to 750 mm x 750 mm

Substrate holder

Water cooled, RF bias

Substrate temperature

Alternatively cryo cooling down to -10°C or heating up to max. 700°C

Alternatively cryo cooling down to -10°C or heating up to max. 850°C

Plasma source

Linear microwave ECR-source PL400 and/or RF parallel plate

Linear microwave ECR-source PL1300 and/or RF parallel plate arrangement

Power supply

MW-Power: max. 9000 W
RF-Power:max. 600 W

MW-Power: max. 48 kW, RF-Power: max. 3 kW

Base Pressure

< 1 x 10-6 mbar

System dimensions (W x D x H)

1.90 m x 1.30 m x 2.20 m (without electrical rack and pumps)

3.70 m x 3.40 m x 2.20 m (without electrical rack, pumps and loading system)

Tool configurations

1 process chamber, 1 load-lock

1 process chamber, 1 loading system, 1 load-lock

Software interface

SECS II / GEM

INDEOtec - Octopus