Low-silver, low-cost alternative for SAC305 with drop-in performance

AIM’s REL61™ is comprised of tin, bismuth, silver, copper and trace amounts of elemental grain structure refiners. REL61 has proven to reduce tin whisker formation as well as outperforming SAC alloys in thermal shock, vibration and drop shock resistance.

Features

• Reduces Tin Whisker Formation
• Enhanced Reliability Versus SAC and Low/No-Silver Alloys
• Low Cost SAC Alloy
• Improved Thermal Cycling Performance
• Improved Wetting Versus All Low/No-Silver Alloys

AIM’s REL22™ alloy is comprised of tin, bismuth, silver, copper, antimony, nickel and trace amounts of elemental grain structure refiners. The alloy provides significantly improved durability for use in applications where thermal shock, vibration and high g-forces are a concern.

Features

• Enhanced Durability for Use in Extremely Harsh Environments
• Reliability Equal to Sn/Ag/Bi/Sb/Ni/Cu Alloys with Wider Assembly Process Window
• Mitigates Tin Whisker Formation
• Creep Rates Lower Than SAC Alloys
• Improved Thermal Cycling Performance
• Improved Wetting Versus All Low/No-Silver Alloys

The Industry Standard - High purity, low dross, suited for all soldering applications

SAC305 is a lead-free alloy that contains 96.5% tin, 3% silver, and 0.5% copper. This alloy falls under the JEIDA recommendation for lead-free soldering. When used in wave soldering, AIM’s SAC305 bar solder offers far superior fluidity as compared to other alloys and makes of bar, resulting in excellent flow. AIM’s SAC305 bar solder also produces less dross than other bar solder, wets well, provides superior joint strength, and offers superior copper dissolution rates. AIM’s SAC305 bar solder is alloyed in the proprietary Electropure™ method that results in a low drossing, high wetting solder. The Electropure process reduces suspended oxides in the solder, thus reducing drossing, improving flow and reducing bridging during soldering. SAC305 may be used with most existing equipment, processes, coatings, and flux chemistries.

Features

• Lowest Cost Sn/Ag/Cu Alloy
• Excellent Fatigue Resistance
• Compatible with all Flux Types
• Excellent Solder Joint Reliability
• Best Wetting Sn/Ag/Cu Alloy

The original silver-free SAC305

SN100C is a lead-free solder alloy that is comprised of tin-copper-nickel + germanium. The properties of SN100C offer an advantage in terms of performance and cost compared to other lead-free alloys. From automotive and aerospace to consumer and telecom, SN100C has a proven history of providing a reliable, cost-effective lead-free alloy solution.

Features

• Smooth, Bright Solder Joints
• Bridge-Free Soldering
• Low Cost - Does Not Contain Silver
• Reduced Copper Erosion from Holes, Pads and Tacks
• Dross Rate Similar to Tin-Lead Alloys
• Complies with IPC J-STD-006
   

High purity and reduces drossing

Sn63/Pb37 Electropure™ is a high purity alloy that is composed of 63% tin and 37% lead. Electropure is alloyed in a proprietary method that results in a low drossing, high wetting solder. The Electropure process reduces suspended oxides in the solder, thus reducing drossing, improving flow, and reducing bridging during soldering. Sn63/Pb37 is a eutectic alloy with a melting point of 183°C (361°F). Typical applications are wave soldering and plating where Sn63/Pb37 is primarily used as a coating for corrosion protection, and as a base for soldering. This alloy is available in bar, solid and cored wire, foil, spheres, preforms, powder, solder paste, ingot, and anode form.

Features

• High Purity
• Reduces Drossing
• Exceeds IPC-J-STD-006 Specifications