AIM - Solder Alloys

SAC alloys have become the standard alloy choice throughout the electronics assembly industry, most commonly SAC305. AIM’s SAC alloys provide excellent solder joint reliability, fatigue resistance and copper dissolution rates. AIM’s SAC alloys comply with IPC, JEDEC, RoHS, and REACH lead-free soldering standards.

Features of SAC305 Lead-Free Alloy

• Lowest Cost Sn/Ag/Cu Alloy
• Excellent Fatigue Resistance
• Compatible with all Flux Types
• Excellent Solder Joint Reliability
• Best Wetting Sn/Ag/Cu Alloy

AIM’s low and no silver alloys provide high performance options compared with the SAC type alloys but with a significant cost saving. AIM’s low and no silver alloy offerings are headlined by next generation REL61TM and the patented SN100C alloy. Both alloys are lower cost options with similar or superior soldering and reliability characteristics compared to SAC alloys. AIM’s low and no silver alloys comply with IPC, RoHS, and REACH standards.

Key Features of SN100C® Lead-Free Solder Alloy

• Smooth, Bright Solder Joints

• Bridge-Free Soldering
• Low Cost - Does Not Contain Silver

Key Features of REL61 Lead-Free Solder Alloy

• Reduces Tin Whisker Formation
• Enhanced Reliability Versus SAC and Low/No-Silver Alloys
• Low Cost SAC Alloy

AIM’s high reliability alloys offer enhanced durability for use in extremely harsh environments. AIM’s REL22TM high reliability alloy provides superior thermal cycling performance, improved wetting, and high mechanical strength. AIM’s high reliability alloys can mitigate tin whisker formation and reduce voiding compared to other high reliability alloys. AIM’s high reliability alloys comply with IPC, RoHS, and REACH standards.

Key Featyres of REL22 High Reliability Lead-Free Solder Alloy

• Enhanced Durability for Use in Extremely Harsh Environments
• Reliability Equal to Sn/Ag/Bi/Sb/Ni/Cu Alloys with Wider Assembly Process Window
• Mitigates Tin Whisker Formation

Key Features of REL61 Lead-Free Solder Alloy

• Reduces Tin Whisker Formation
• Enhanced Reliability Versus SAC and Low/No-Silver Alloys
• Low Cost SAC Alloy

AIM’s low temperature soldering materials includes low and reduced temperature reflow requirements. AIM’s lead-free low temperature alloys provide a melting temperature of 140°C-170°C reducing peak reflow temperatures by as much as 50°C.  AIM low temperature fluxes have been specially formulated to work in combination with Sn/Bi (X) alloys to provide excellent processing characteristics as well as excellent wetting and joint strength.

AIM’s leaded solder alloys offer a low melting point and increased reliability over lead free solder alternatives. AIM’s leaded (Pb-bearing) solder alloys continue to be used/specified in medical, military, and aerospace applications.

Features of Sn63/Pb37 Electropure™

• High Purity
• Reduces Drossing
• Exceeds IPC-J-STD-006 Specifications