AIM - Solder Paste

AIM’s no clean solder paste combines performance and reliability without the expense of cleaning. Designed to provide stable transfer efficiencies, powerful wetting, and low voiding, AIM no clean solder pastes address current and future assembly challenges. AIM’s full line of no clean solder paste is available in a wide selection of alloys to meet your process requirements. AIM has partnered with industry cleaner and chemistry manufacturers to ensure residue can be removed when necessary. 

Available Solder Paste Products

• H10 Halogen-Free No Clean Solder Paste
• M8 No Clean Solder Paste
• V9 Low-Voiding Solder Paste
• J8 No Clean Jetting Solder Paste
• NC273LT Low Temperature Solder Paste
• NC257MD Jet Printing Solder Paste

AIM’s water soluble solder paste products have been engineered for powerful wetting and exceptional print performance even in high humidity environments. AIM water soluble paste residues are easily removed with DI water alone up to 48 hours after reflow, even under low stand-off devices. AIM’s formulations provide a low foaming solder paste that can extend closed loop filtration service life. AIM’s water soluble product offerings exceed industry demands for a reliable, low voiding solder paste.

Key Features of W20 Water Soluble Solder Paste

• Zero Halide/Halogen per J-STD-004/B
• RoHS Compliant (lead-free alloys only)
• DI Water Wash

Key Features of WS488 Solder Paste

• Excellent Wetting
• Extended Cleaning Window
• Superior Slump Resistance

AIM’s RMA/RA solder pastes are designed for use where mil spec performance is required. AIM rosin based solder pastes provide modern paste print performance combined with traditional military compliance. Additionally, AIM’s RMA/RA solder pastes can withstand extended hot reflow profiles required for backplane and thermally massive assemblies. AIM’s rosin solder pastes provide superior performance on oxidized or uncleaned surfaces and long pause-to-print capabilities. AIM has partnered with aqueous, solvent and vapor degreaser cleaning manufacturers to ensure residues can be removed with all systems and leave no white residue.

Features of RMA258-15R Solder Paste

• Long Pause-to-Print Capabilities
• Enhances Fine Print Definitions
• No Head-in-Pillow
• Excellent Wetting, Even Leadless Devices
• Exceptional Reflow During Long, Hot Profiles
• Reduced Voiding
• Available in Industry Standard Sizes

AIM’s low temperature solder paste offers exceptional performance combined with peak reflow temperatures as low as 170°C. AIM’s NC273LT solder paste provides 8+ hour stencil life, stable transfer efficiency and excellent wetting, while eliminating solder balling that is common with bismuth bearing pastes.

Features of NC273LT Low Temperature Solder Paste

• Designed for Low Temperature Applications
• Improved Wetting for Bismuth Alloys
• Long Stencil Life
• Excellent Transfer Efficiencies
• Minimizes Solder Balling
• RoHS Compliant